Feature:Thermal properties, strong adhesionUsed to paste heat sink with IC chips, and be cooling body with good thermal effectSpecifications:Model: STARS-922Thermal conductivity : >0.671 W/m-kThermal resistance : <0.06 °C-in2/WStrength of connected buildings:1.5mapSurface curing time 10MIN/25 DEGREENet Weight: 5gNotes:Viscosity control better, with just a little more force to remove the heat sink (rotating around a few can be removed),removed after wipe clean with paper towels. Package Included: 1x STARS-922 Heatsink Plaster